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Powder metallurgy improves the performance of core components of mobile phones, from heat dissipation to structural parts.

Release time:2025/11/09
At a time when mobile phones are developing towards high performance, long battery life and lightness, the performance of core components directly determines the user experience. With the advantages of precision molding, controllable performance and efficient utilization of materials, powder metallurgy technology can be used in mobile phones.Thermal components, structural brackets, connectors and other core links have achieved breakthroughs, providing key support for mobile phone performance upgrading, and becoming an indispensable and important process in mobile phone manufacturing.
The performance of mobile phone processors is constantly improving, and the heat dissipation problem has become the key to its performance, and the heat dissipation components manufactured by powder metallurgy provide a solution to this problem. Traditional mobile phones mostly use pure copper or aluminum alloy heat sinks for heat dissipation. Pure copper has high heat dissipation efficiency but heavy weight, and aluminum alloy is lightweight but lacks heat dissipation performance. The copper-aluminum composite heat dissipation structure manufactured by powder metallurgy through the "copper-aluminum composite powder + sintering molding" process not only retains the high thermal conductivity of copper (thermal conductivity reaches 380W/(m・K), close to the level of pure copper), but also has the lightweight advantage of aluminum (the weight is 4 less than that of pure copper heat sinks) 0%).According to the test data of a mobile phone manufacturer, after using powder metallurgy copper-aluminum composite heat dissipation components, the temperature of the mobile phone processor at full load is reduced by 3-5℃, and the stuttering phenomenon is reduced by 60%, effectively prolonging the high-performance running time of the processor. In addition, powder metallurgy can also manufacture porous heat dissipation brackets. By controlling the porosity (20%-30%), the heat dissipation area can be increased by more than 2 times, further improving the heat dissipation efficiency, and adapting to the high-power heat dissipation needs of 5G mobile phones.
In the field of mobile phone structural parts, the precision forming ability of powder metallurgy meets the requirements of complex structure and high precision. As the core structural part connecting the screen, battery and motherboard, the middle frame of the mobile phone needs to have high strength, high flatness and can integrate a variety of interface grooves. The traditional stamping process is difficult to mold complex structures at once, and requires multiple processes to be spliced, which not only has low accuracy (error reaches ±0.1mm), there is also a hidden danger of structural strength. Powder metallurgy adopts the "aluminum alloy powder + metal injection molding (MIM)" process, which can directly manufacture an integrated middle frame. The size accuracy is controlled at ±0.03mm, and the flatness error is less than 0.02mm. There is no need for a large number of subsequent finishing, and the production efficiency is improved by 50%. At the same time, by adjusting the powder composition (adding magnesium and silicon elements), the tensile strength of the middle frame is increased to more than 300MPa, which is 25% higher than the traditional stamping middle frame, and the drop resistance is significantly enhanced, effectively reducing the probability of damage when the mobile phone falls.
The mobile phone connector is a key component for signal and power transmission, and the requirements for conductivity and wear resistance are extremely high. Traditional connectors adopt brass electroplating technology. After long-term use, it is easy to cause plating wear and increased contact resistance, which affects the stability of signal transmission.Powder metallurgy adopts the "high-purity copper powder + hot pressing sintering" process to manufacture connector pins, with a density of more than 99.8%. The surface can have excellent electrical conductivity (resistivity is only 1.7×10^-8Ω・m) without electroplating, and by adding a small amount of nickel, the wear resistance is more traditional. The brass pin has been increased by 3 times, and the plug-in and pull-out life has been extended from 5,000 times to 15,000 times, meeting the reliability needs of long-term use of mobile phones.
From solving heat dissipation problems to enhancing structural stability, from improving the life of connectors to adapting complex molding needs, powder metallurgy is promoting the continuous upgrading of the performance of core components of mobile phones with multi-dimensional advantages, providing a strong guarantee for technological innovation in the mobile phone industry.


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